一、Introduction
1-1 System integration trend
1-2 2024 leading company solutions
1-3 Mega trend of HPC system integration
1-4 Future Systems for GAI
二、Heterogeneous integration solutions WW
2-1 SX(2.XD) substrate integration structures
2-2 Mapping of tradenames to SX integrated substrate
2-3 Glass Substrate
三、Substrate 2.0
3-1 Future substrate trend: Substrate 2.0
3-2 Critical technologies needed for substrate 2.0
四、Solutions for substrate 2.0
4-1 solutions for large format substrate (>100x100 mm)
五、Summary, Conclusions and QA
三建可為企業規劃專屬內訓課程，含客製化大綱、講師派遣與教材配套。