一、Fundamentals of Logic-on-memory integration to leverage RDL and micro-bumping
二、TSV process and die stacking for HBM
三、Wafer level Hybrid bonding for CIS, 3D NAND,
四、CoW(D2W) Hybrid bonding for next Gen. HBM
五、3D Fan-Out memory module for hyper digital twinning
三建可為企業規劃專屬內訓課程，含客製化大綱、講師派遣與教材配套。