【中文譯本】
隨著業界對CPO共封裝光學的重視程度日益增加，並將其視為戰略方向，深入了解矽光子學的複雜性變得至關重要，因為其能力和功能對於CPO共封裝光學可以為更廣泛的 CMOS 生態系統帶來的優勢產生重大影響。
本課程將概述能夠實現CPO共封裝光學的工具、技術和方法，全面探索矽 (Si) 光子學在推動和支持當前產業中正在進行的CPO共封裝光學的巨大潛力，更將特別討論光學收發器、光子/電子元件的共同設計以及光模組封裝挑戰等方面的性能預期。
【英文原稿】
As the industry places increasing emphasis on co-packaged optics as a strategic direction, understanding the intricacies of Si photonics becomes pivotal, as its capabilities and functionalities wield a significant influence over the advantages that co-packaged optics can bring to the broader CMOS ecosystem. As such the tools, technologies and approaches which enable co-packaged optics will be overviewed in this course. A thorough exploration of the remarkable potential of Silicon (Si) photonics in driving and supporting the ongoing co-packaged optics initiatives within the current industry landscape. In particular, the performance expectations on fronts including optical transceivers, co-design of photonics / electronics components, as well as optical module packaging challenges will be discussed.
三建可為企業規劃專屬內訓課程，含客製化大綱、講師派遣與教材配套。