【中文譯本】
利用矽光子學和共封裝光學的密集波長分波多工 (DWDM) 正受到越來越多關注，這種技術因能在可接受的功耗範圍內實現帶寬和帶寬密度的加速擴展，被視為支援現代高性能和數據中心應用的潛在解決方案，而這些應用需要應對新興的機器學習和AI人工智慧工作負載，因此 DWDM 技術的重要性日益突顯。本課程將概述在元件、電路和連結架構級別上設計和優化這種系統的方法，並將討論推動CPO共封裝光學所帶來的連結架構挑戰和機會，包括信號完整性和散熱考量。
【英文原稿】
Dense Wavelength Division Multiplexing using Silicon Photonics and Co-Packaged Optics is receiving increasing attention as a potential candidate to support the accelerating scaling trend in bandwidth and bandwidth density at acceptable power consumption envelope in modern high performance and data center applications, required by emerging machine learning and artificial intelligence workloads. This presentation overviews the methodology for design and optimization of such systems on a large scale, at the device, circuit and link architecture level. It also discusses the challenges and opportunities of the link architecture implications presented by the push towards co-packaged optics, including signal integrity and thermal considerations.
三建可為企業規劃專屬內訓課程，含客製化大綱、講師派遣與教材配套。